AMD Ryzen Embedded R1102G kontra Intel Xeon E3-1275 v6. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Desktop / Server Desktop / Server
• Seria
  AMD Ryzen Embedded Intel Xeon E3
• Pokolenie
  1 6
• Grupa CPU
  AMD Ryzen Embedded R1000 Intel Xeon E3 v6

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.20 GHz 3.80 GHz
• Rdzenie CPU
  2 4
• Turbo (1 rdzeń)
  2.60 GHz 4.20 GHz
• CPU Threads
  2 8
• Hyperthreading
  Nie Tak
• Overclocking
  Nie Nie
• Architektura podstawowa
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  AMD Radeon Vega 3 Graphics Intel HD Graphics P630
• GPU frequency
  1.00 GHz 0.35 GHz
• GPU (Turbo)
  No turbo 1.15 GHz
• Jednostki wykonawcze
  3 24
• Shader
  192 192
• Max. GPU Memory
  2 GB 64 GB
• Max. displays
  3 3
• Pokolenie
  8 9.5
• DirectX Version
  12 12
• Proces technologiczny
  14 nm 14 nm
• Data wydania
  Q1/2018 Q2/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Nie Nie
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Intel Xeon E3-1275 v6 oraz AMD Ryzen Embedded R1102G. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR4-2400 DDR4-2400
• Max. Pamięć
  32 GB
• ECC
  Tak Tak
• Kanały pamięci
  2 2
• Wersja PCIe
  3.0 3.0
• Pasma PCIe
  8 16

• AES-NI
  Tak Tak

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded R1102G oraz Intel Xeon E3-1275 v6 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W 73 W
• Temperatura maksymalna
  105 °C --

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded R1102G oraz Intel Xeon E3-1275 v6, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Wirtualizacja
  AMD-V, SVM VT-x, VT-x EPT, VT-d
• Rozszerzenia ISA
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.1, SSE4.2, AVX2
• L3-Cache
  4.00 MB 8.00 MB
• Architektura
  Banded Kestrel (Zen) Kaby Lake S
• Proces technologiczny
  14 nm 14 nm
• Gniazdo
  FP5 LGA 1151
• Data wydania
  Q1/2020 Q1/2017