Qualcomm Snapdragon 780G vs MediaTek Dimensity 810. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  Qualcomm Snapdragon Mediatek Dimensity
• 세대
  4 2
• CPU 그룹
  Qualcomm Snapdragon 780 MediaTek Dimensity 810

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 빈도
  1.90 GHz 2.00 GHz
• CPU 코어
  8 8
• Turbo (1 Core)
  2.40 GHz 2.40 GHz
• CPU 스레드
  8 8
• Turbo (8 Cores)
  2.20 GHz 2.00 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A core
  1x Kryo 670 Prime 4x Cortex-A76
• B core
  3x Kryo 670 Gold 4x Cortex-A55
• C core
  4x Kryo 670 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  Qualcomm Adreno 642 ARM Mali-G57 MP2
• GPU frequency
  0.90 GHz
• GPU (Turbo)
  터보 없음 터보 없음
• 실행 단위
  4 2
• Shader
  384 32
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 2
• 세대
  5 Vallhall 1
• DirectX Version
  12.0 12
• 기술
  5 nm 7 nm
• 릴리스 날짜
  Q2/2021 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  아니요 Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 810 그리고 Qualcomm Snapdragon 780G. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-2133 LPDDR4X-2133
• 최대. Memory
  16 GB 16 GB
• ECC
  아니요 아니요
• 메모리 채널
  2 2

• AES-NI
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 780G 그리고 MediaTek Dimensity 810 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 780G 그리고 MediaTek Dimensity 810, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 가상화
  None None
• L3-Cache
  2.00 MB --
• 아키텍처
  Kryo 670 Cortex-A76 / Cortex-A55
• 기술
  5 nm 6 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q2/2021 Q3/2021
• Part Number
  SM7350 --