MediaTek Kompanio 500 vs Qualcomm Snapdragon 870. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 가족
  Mediatek Kompanio Qualcomm Snapdragon
• CPU 그룹
  MediaTek Kompanio 500 Qualcomm Snapdragon 865/870
• 세그먼트
  Mobile Mobile
• 세대
  1 7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 핵심 아키텍처
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• 오버클러킹
  아니요 아니요

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  ARM Mali-G72 MP3 Qualcomm Adreno 650
• GPU frequency
  0.80 GHz 0.25 GHz
• GPU (Turbo)
  터보 없음 0.67 GHz
• 실행 단위
  3 2
• Shader
  48 512
• Max. GPU Memory
  2 GB --
• Max. displays
  1 1
• 세대
  Bifrost 2 6
• 기술
  16 nm 7 nm
• 릴리스 날짜
  Q3/2017 Q4/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  아니요 아니요
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 870 그리고 MediaTek Kompanio 500. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR3LPDDR4X LPDDR4X-4266LPDDR5-5500
• 최대. Memory
  16 GB
• 메모리 채널
  0 4
• ECC
  아니요 아니요

Analyze the TDP (Thermal Design Power) requirements of MediaTek Kompanio 500 그리고 Qualcomm Snapdragon 870 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Kompanio 500 그리고 Qualcomm Snapdragon 870, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L3-Cache
  -- 3.00 MB
• 아키텍처
  Cortex-A73 / Cortex-A53 Kryo 585
• 기술
  12 nm 7 nm
• 가상화
  None None
• 소켓
  N/A N/A
• 릴리스 날짜
  Q4/2019 Q2/2021
• Part Number
  MT8183 SM8250-AC