MediaTek Dimensity 1200 vs Qualcomm Snapdragon 765G. 사양, 성능, 테스트

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 세그먼트
  Mobile Mobile
• 가족
  Mediatek Dimensity Qualcomm Snapdragon
• 세대
  2 3
• CPU 그룹
  MediaTek Dimensity 1100/1200 Qualcomm Snapdragon 760

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 빈도
  2.00 GHz 1.80 GHz
• Turbo (1 Core)
  3.00 GHz 2.40 GHz
• Turbo (8 Cores)
  2.60 GHz 2.20 GHz
• Hyperthreading
  아니요 아니요
• 오버클러킹
  아니요 아니요
• 핵심 아키텍처
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU 이름
  ARM Mali-G77 MP9 Qualcomm Adreno 620
• GPU frequency
  0.85 GHz 0.75 GHz
• GPU (Turbo)
  터보 없음 터보 없음
• 실행 단위
  9 0
• Shader
  144 192
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 2
• 세대
  Vallhall 1 6
• 기술
  7 nm 7 nm
• 릴리스 날짜
  Q2/2019 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Decode 아니요
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 765G 그리고 MediaTek Dimensity 1200. The supported memory frequencies may vary depending on the motherboard configuration.

• 메모리 유형
  LPDDR4X-2133 LPDDR4-3733
• 최대. Memory
  8 GB
• ECC
  아니요 아니요
• 메모리 채널
  4 2

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 1200 그리고 Qualcomm Snapdragon 765G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 1200 그리고 Qualcomm Snapdragon 765G, including virtual machine technologies and fabrication processes.

• 명령어 세트(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 가상화
  None None
• L3-Cache
  -- 2.00 MB
• 아키텍처
  Cortex-A78 / Cortex-A55 Kryo 475
• 기술
  6 nm 7 nm
• 소켓
  N/A N/A
• 릴리스 날짜
  Q1/2021 Q3/2020
• Part Number
  MT6893 SM7250-AB