Qualcomm Snapdragon 850 対 Qualcomm Snapdragon 429. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  Qualcomm Snapdragon Qualcomm Snapdragon
• 世代
  5 4
• CPUグループ
  Qualcomm Snapdragon 845 Qualcomm Snapdragon 429

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  1.80 GHz 1.95 GHz
• CPUコア
  8 4
• ターボ(1コア)
  2.95 GHz 1.95 GHz
• CPUスレッド
  8 4
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  hybrid (big.LITTLE) normal
• A core
  4x Kryo 385 Gold --
• B core
  4x Kryo 385 Silver --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 630 Qualcomm Adreno 504
• GPU frequency
  0.70 GHz 0.50 GHz
• GPU (Turbo)
  ターボなし 0.50 GHz
• シェーダー
  256 0
• Max. GPU Memory
  8 GB --
• Max. displays
  2 0
• 世代
  4 5
• DirectX Version
  11 11
• ぎじゅつてきなかだい
  10 nm 12 nm
• 発売日
  Q1/2018 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode いいえ
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode いいえ
• VP8
  Decode いいえ
• AV1
  いいえ いいえ
• AVC
  Decode いいえ
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 429 と Qualcomm Snapdragon 850. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-1866 LPDDR3
• マックス メモリ
  8 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  4 1

• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 850 と Qualcomm Snapdragon 429 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 850 と Qualcomm Snapdragon 429, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• 建築
  Kryo 385 Cortex-A53
• ぎじゅつてきなかだい
  10 nm 12 nm
• ソケット
  N/A N/A
• 発売日
  Q3/2018 Q3/2018
• Part Number
  SDM850 SDM429