Qualcomm Snapdragon 835 対 Qualcomm Snapdragon 732G. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  Qualcomm Snapdragon Qualcomm Snapdragon
• 世代
  4 2
• CPUグループ
  Qualcomm Snapdragon 830 Qualcomm Snapdragon 730

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  1.90 GHz 1.80 GHz
• ターボ(1コア)
  2.45 GHz 2.30 GHz
• Turbo (8 Cores)
  2.45 GHz 2.20 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 540 Qualcomm Adreno 618
• GPU frequency
  0.71 GHz 0.95 GHz
• GPU (Turbo)
  0.71 GHz ターボなし
• シェーダー
  384 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 2
• 世代
  5 6
• ぎじゅつてきなかだい
  10 nm 14 nm
• 発売日
  Q1/2017 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  いいえ Decode
• h264
  Decode Decode / Encode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  いいえ いいえ
• AVC
  いいえ Decode
• VC-1
  Decode Decode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 732G と Qualcomm Snapdragon 835. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-1866 LPDDR4X-1866
• マックス メモリ
  8 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  2 2

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 835 と Qualcomm Snapdragon 732G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 835 と Qualcomm Snapdragon 732G, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• 建築
  Kryo 280 Kryo 470 Gold/475 Silver
• ぎじゅつてきなかだい
  10 nm 8 nm
• ソケット
  N/A N/A
• 発売日
  Q2/2017 Q3/2020
• Part Number
  MSM8998 SM7150-AC