Qualcomm Snapdragon 730 対 Qualcomm Snapdragon 690. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• シリーズ
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPUグループ
  Qualcomm Snapdragon 730 Qualcomm Snapdragon 690
• セグメント
  Mobile Mobile
• 世代
  2 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• コア・アーキテクチャ
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• 周波数
  1.80 GHz 1.70 GHz
• ターボ(1コア)
  2.20 GHz 2.00 GHz
• Turbo (8 Cores)
  2.20 GHz 1.70 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 618 Qualcomm Adreno 619L
• GPU frequency
  0.70 GHz 0.95 GHz
• GPU (Turbo)
  ターボなし ターボなし
• シェーダー
  128 0
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• 世代
  6 6
• ぎじゅつてきなかだい
  14 nm 8 nm
• 発売日
  Q2/2019 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode
• VP8
  Decode Decode
• VP9
  Decode Decode
• AV1
  いいえ いいえ
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 690 と Qualcomm Snapdragon 730. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-1866 LPDDR4X-1866
• マックス メモリ
  8 GB
• メモリーチャンネル
  2 2
• ECC
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 730 と Qualcomm Snapdragon 690 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 730 と Qualcomm Snapdragon 690, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 建築
  Kryo 470 Gold/475 Silver Kryo 560
• ぎじゅつてきなかだい
  8 nm 8 nm
• 仮想化
  None None
• ソケット
  N/A N/A
• 発売日
  Q2/2019 Q4/2020
• Part Number
  SM7150-AA SM6350