Qualcomm Snapdragon 670 対 MediaTek Dimensity 1000L. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  Qualcomm Snapdragon Mediatek Dimensity
• 世代
  6 1
• CPUグループ
  Qualcomm Snapdragon 670 MediaTek Dimensity 1000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  1.70 GHz 2.00 GHz
• CPUコア
  8 8
• ターボ(1コア)
  2.00 GHz 2.20 GHz
• CPUスレッド
  8 8
• Turbo (8 Cores)
  1.70 GHz 2.00 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Kryo 360 Gold 4x Cortex-A77
• B core
  6x Kryo 360 Silver 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  Qualcomm Adreno 615 ARM Mali-G77 MP7
• GPU frequency
  0.70 GHz 0.70 GHz
• GPU (Turbo)
  0.70 GHz ターボなし
• 実行部隊
  0 7
• シェーダー
  256 112
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 1
• 世代
  6 Vallhall 1
• DirectX Version
  12.1 12
• ぎじゅつてきなかだい
  10 nm 7 nm
• 発売日
  Q2/2018 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• AV1
  いいえ Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 1000L と Qualcomm Snapdragon 670. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-1866 LPDDR4X-1866
• マックス メモリ
  12 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  2 4

• AES-NI
  いいえ いいえ

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 670 と MediaTek Dimensity 1000L to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 670 と MediaTek Dimensity 1000L, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• 建築
  Kryo 360 Cortex-A77 / Cortex-A55
• ぎじゅつてきなかだい
  10 nm 7 nm
• ソケット
  N/A N/A
• 発売日
  Q3/2018 Q1/2020
• Part Number
  SDM670 MT6885Z/CZA