HiSilicon Kirin 810 対 Qualcomm Snapdragon 750G. 仕様・性能・テスト

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• セグメント
  Mobile Mobile
• シリーズ
  HiSilicon Kirin Qualcomm Snapdragon
• 世代
  6 3
• CPUグループ
  HiSilicon Kirin 810/820 Qualcomm Snapdragon 750

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 周波数
  1.90 GHz 1.80 GHz
• ターボ(1コア)
  2.20 GHz 2.20 GHz
• Turbo (8 Cores)
  2.20 GHz 2.20 GHz
• ハイパースレッディング
  いいえ いいえ
• オーバークロッキング
  いいえ いいえ
• コア・アーキテクチャ
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名
  ARM Mali-G52 MP6 Qualcomm Adreno 619
• GPU frequency
  0.85 GHz 0.95 GHz
• GPU (Turbo)
  ターボなし ターボなし
• 実行部隊
  16 0
• シェーダー
  288 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• 世代
  Bifrost 2 6
• ぎじゅつてきなかだい
  12 nm 8 nm
• 発売日
  Q1/2018 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  いいえ いいえ
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 750G と HiSilicon Kirin 810. The supported memory frequencies may vary depending on the motherboard configuration.

• メモリータイプ
  LPDDR4X-2133 LPDDR4X-2133
• マックス メモリ
  6 GB 8 GB
• ECC
  いいえ いいえ
• メモリーチャンネル
  4 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 810 と Qualcomm Snapdragon 750G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 810 と Qualcomm Snapdragon 750G, including virtual machine technologies and fabrication processes.

• 命令セット(ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 仮想化
  None None
• L3-Cache
  1.00 MB --
• 建築
  Cortex-A76 / Cortex-A55 Kryo 570
• ぎじゅつてきなかだい
  7 nm 8 nm
• ソケット
  N/A N/A
• 発売日
  Q2/2019 Q4/2020
• Part Number
  -- SM7225