MediaTek Helio P95 contro Qualcomm Snapdragon 850. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Helio Qualcomm Snapdragon
• Gruppo CPU
  MediaTek Helio P65/P90/P95 Qualcomm Snapdragon 845
• Segmento
  Mobile Mobile
• Generazione
  3 5
• Modello passato
  MediaTek Helio P90 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architettura di base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclock
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  PowerVR GM 9446 Qualcomm Adreno 630
• GPU frequency
  0.95 GHz 0.70 GHz
• GPU (Turbo)
  No turbo No turbo
• Unità di esecuzione
  3 0
• Shader
  12 256
• Max. GPU Memory
  2 GB 8 GB
• Max. displays
  0 2
• Generazione
  1 4
• Processo tecnico
  12 10 nm
• Data di rilascio
  Q3/2017 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  No Decode
• VP9
  No Decode
• AV1
  No No
• AVC
  No Decode
• VC-1
  No Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 850 e MediaTek Helio P95. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  LPDDR4X-1866 LPDDR4X-1866
• Max. Memoria
  8 GB 8 GB
• Canali di memoria
  2 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio P95 e Qualcomm Snapdragon 850 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio P95 e Qualcomm Snapdragon 850, including virtual machine technologies and fabrication processes.

• Set di istruzioni (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architettura
  Cortex-A75 / Cortex-A55 Kryo 385
• Processo tecnico
  12 nm 10 nm
• Virtualizzazione
  None None
• Presa
  N/A N/A
• Data di rilascio
  Q1/2020 Q3/2018
• Part Number
  -- SDM850