AMD Ryzen Embedded V3C14 contro AMD Ryzen Embedded V3C16. Specifiche, prestazioni, test

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  AMD Ryzen Embedded V AMD Ryzen Embedded V
• Gruppo CPU
  AMD Ryzen Embedded V3000 AMD Ryzen Embedded V3000
• Segmento
  Desktop / Server Desktop / Server
• Generazione
  3 3
• Modello passato
  -- AMD Ryzen Embedded V2516

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 8 6 / 12
• Architettura di base
  normal normal
• Nuclei
  4x Zen 3 6x Zen 3
• Hyperthreading / SMT
  Sì Sì
• Overclock
  No No
• Frequenza
  2.30 GHz 2.00 GHz
• Turbo Frequency (1 Core)
  3.80 GHz 3.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome della GPU
  no iGPU no iGPU
• GPU (Turbo)
  No turbo No turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  No No
• VP8
  No No
• VP9
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  No No
• JPEG
  No No

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded V3C16 e AMD Ryzen Embedded V3C14. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo di memoria
  DDR5-4800 DDR5-4800
• Max. Memoria
  64 GB 64 GB
• Canali di memoria
  2 (Dual Channel) 2 (Dual Channel)
• Bandwidth
  76.8 GB/s 76.8 GB/s
• ECC
  Sì Sì
• PCIe
  4.0 x 20 4.0 x 20
• AES-NI
  Sì Sì

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded V3C14 e AMD Ryzen Embedded V3C16 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 15 W
• TDP up
  25 W 25 W
• TDP down
  10 W 10 W
• Temperatura massima
  105 °C 105 °C

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded V3C14 e AMD Ryzen Embedded V3C16, including virtual machine technologies and fabrication processes.

• Processo tecnico
  6 nm 6 nm
• Chip design
  Chiplet Chiplet
• Presa
  FP7r2 FP7r2
• L2-Cache
  2.00 MB 3.00 MB
• L3-Cache
  8.00 MB 16.00 MB
• Architettura
  Rembrandt (Zen 3+) Rembrandt (Zen 3+)
• Operating systems
  Windows 10, Windows 11, Linux Windows 10, Windows 11, Linux
• Virtualizzazione
  AMD-V, SVM AMD-V, SVM
• Set di istruzioni (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Estensioni ISA
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• Data di rilascio
  Q3/2022 Q3/2022
• Specifica
  Technical data sheet Technical data sheet