UNISOC T760 contre UNISOC T770. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  UNISOC 5G UNISOC 5G
• Groupe de CPU
  UNISOC 5G 6nm UNISOC 5G 6nm
• Segment
  Mobile Mobile

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Architecture de base
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  4x Cortex-A76 1x Cortex-A76
• B-Core
  4x Cortex-A55 3x Cortex-A76
• Hyperthreading / SMT
  Non Non
• Overclocking
  Non Non
• A-Core Frequency
  2.20 GHz 2.50 GHz
• B-Core Frequency
  2.00 GHz 2.20 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  ARM Mali-G57 MP4 ARM Mali-G57 MP4
• GPU frequency
  0.65 GHz 0.78 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Unités d'exécution
  4 4
• Shader
  64 64
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Génération
  Vallhall 1 Vallhall 1
• Direct X
  12 12
• Processus technologique
  7 nm 7 nm
• Date de sortie
  Q2/2020 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by UNISOC T770 et UNISOC T760. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4X-2133 LPDDR4-2133LPDDR4X-2133
• Canaux de mémoire
  2 (Dual Channel) 2 (Dual Channel)
• ECC
  Non Non
• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of UNISOC T760 et UNISOC T770 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T760 et UNISOC T770, including virtual machine technologies and fabrication processes.

• Processus technologique
  6 nm 6 nm
• Operating systems
  Android Android
• Virtualization
  None None
• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Date de sortie
  Q2/2021 Q1/2020
• spécification
  Technical data sheet Technical data sheet