UNISOC T310 contre MediaTek Helio A22. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  UNISOC 4G Mediatek Helio
• Groupe de CPU
  UNISOC 4G 12nm MediaTek Helio A22
• Segment
  Mobile Mobile
• Génération
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 4 / 4
• Architecture de base
  hybrid (big.LITTLE) normal
• Hyperthreading / SMT
  Non Non
• Overclocking
  Non Non

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  PowerVR GE8300 PowerVR GE8300
• GPU frequency
  0.80 GHz 0.65 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Unités d'exécution
  1 1
• Max. displays
  1 1
• Direct X
  10 10
• Processus technologique
  20 nm 20 nm
• Date de sortie
  Q1/2017 Q1/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Non
• h265 / HEVC (10 bit)
  Non Non
• h264
  Non Non
• VP8
  Non Non
• VP9
  Non Non
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Non Non
• JPEG
  Non Non

Overview of the types and quantities of RAM supported by MediaTek Helio A22 et UNISOC T310. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3-933LPDDR4-1333LPDDR4X-1333 LPDDR4X-3200
• Max. Mémoire
  3 GB
• Canaux de mémoire
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 1
• ECC
  Non Non
• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of UNISOC T310 et MediaTek Helio A22 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T310 et MediaTek Helio A22, including virtual machine technologies and fabrication processes.

• Processus technologique
  12 nm 16 nm
• Socket
  -- N/A
• Architecture
  Cortex-A53 / Cortex-A53
• Operating systems
  Android Android
• Virtualization
  None None
• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Date de sortie
  Q2/2019 Q2/2020
• spécification
  Technical data sheet --