Qualcomm Snapdragon 680 4G contre MediaTek Helio G88. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Qualcomm Snapdragon Mediatek Helio
• Groupe de CPU
  Qualcomm Snapdragon 680 MediaTek Helio G70/G80
• Segment
  Mobile Mobile
• Génération
  6 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  Non Non

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 610 ARM Mali-G52 MP2
• GPU frequency
  1.00 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Unités d'exécution
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 2
• Shader
  128 32
• Max. GPU Memory
  4 GB --
• Max. displays
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 2
• Génération
  6 Bifrost 2
• Processus technologique
  11 nm 16 nm
• Date de sortie
  Q2/2019 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  Non Non
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G88 et Qualcomm Snapdragon 680 4G. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4X-2133 LPDDR4X-1800
• Max. Mémoire
  4 GB 8 GB
• Canaux de mémoire
  2 2
• ECC
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 680 4G et MediaTek Helio G88 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 680 4G et MediaTek Helio G88, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Extensions ISA
  --
• Architecture
  Kryo 265 Cortex-A75 / Cortex-A55
• Processus technologique
  6 nm 12 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Date de sortie
  Q1/2022 Q2/2020
• Part Number
  SM6225 MT6769Z