Qualcomm Snapdragon 650 contre HiSilicon Kirin 650. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  Qualcomm Snapdragon HiSilicon Kirin
• Génération
  4 4
• Groupe de CPU
  Qualcomm Snapdragon 650 HiSilicon Kirin 650

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.40 GHz 1.70 GHz
• Cœurs de CPU
  6 8
• Turbo (1 cœur)
  1.80 GHz 2.00 GHz
• Fils de processeur
  6 8
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A72 4x Cortex-A53
• B core
  4x Cortex-A53 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 510 ARM Mali-T830 MP2
• GPU frequency
  0.60 GHz 0.90 GHz
• GPU (Turbo)
  0.60 GHz 0.90 GHz
• Unités d'exécution
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 2
• Shader
  128 32
• Max. displays
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 2
• Génération
  5 Midgard 4
• DirectX Version
  11 11
• Processus technologique
  14 nm 28nm
• Date de sortie
  Q4/2015 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Non Decode
• h264
  Decode Decode / Encode
• VP9
  Decode Non
• VP8
  Decode Decode / Encode
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Decode Non
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 650 et Qualcomm Snapdragon 650. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3-933 LPDDR3-933
• ECC
  Non Non
• Canaux de mémoire
  2 2

• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 650 et HiSilicon Kirin 650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 650 et HiSilicon Kirin 650, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A72 / Cortex-A53 Cortex-A53 / Cortex-A53
• Processus technologique
  28 nm 16 nm
• Socket
  N/A N/A
• Date de sortie
  Q1/2016 Q2/2016
• Part Number
  MSM8956 --