MediaTek MT8766B contre HiSilicon Kirin 710. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Mediatek MT-Serie HiSilicon Kirin
• Groupe de CPU
  MediaTek MT87xx 12nm HiSilicon Kirin 710
• Segment
  Mobile Mobile
• Génération
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architecture de base
  normal hybrid (big.LITTLE)
• Overclocking
  Non Non
• Fréquence
  2.00 GHz 1.70 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  PowerVR GE8300 ARM Mali-G51 MP4
• GPU frequency
  0.01 GHz 0.65 GHz
• GPU (Turbo)
  Pas de turbo 1.00 GHz
• Unités d'exécution
  1 8
• Shader
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Génération
  Bifrost 1
• Processus technologique
  20 nm 12 nm
• Date de sortie
  Q1/2017 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Decode / Encode
• h265 / HEVC (10 bit)
  Non Non
• h264
  Non Decode / Encode
• VP8
  Non Decode / Encode
• VP9
  Non Decode / Encode
• AV1
  Non Non
• AVC
  Non Decode / Encode
• VC-1
  Non Decode / Encode
• JPEG
  Non Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 710 et MediaTek MT8766B. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3LPDDR4 LPDDR3LPDDR4
• Max. Mémoire
  6 GB
• Canaux de mémoire
  Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système. 2
• ECC
  Non Non

Analyze the TDP (Thermal Design Power) requirements of MediaTek MT8766B et HiSilicon Kirin 710 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek MT8766B et HiSilicon Kirin 710, including virtual machine technologies and fabrication processes.

• Processus technologique
  12 nm 12 nm
• Socket
  -- N/A
• L2-Cache
  1.00 MB --
• L3-Cache
  -- 1.00 MB
• Architecture
  Cortex-A53 Cortex-A73 / Cortex-A53
• Virtualization
  None None
• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Date de sortie
  Q2/2020 Q3/2018