Intel Core m3-6Y30 contre Intel Core m7-6Y75. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  Intel Core M Intel Core M
• Génération
  6 6
• Groupe de CPU
  Intel Core M 6 Intel Core M 6

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  0.90 GHz 1.20 GHz
• Cœurs de CPU
  2 2
• Turbo (1 cœur)
  2.20 GHz 3.10 GHz
• Fils de processeur
  4 4
• Turbo (2 Cores)
  1.80 GHz 2.40 GHz
• Hyperthreading
  Oui Oui
• Overclocking
  Non Non
• Architecture de base
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Intel HD Graphics 515 Intel HD Graphics 515
• GPU frequency
  0.30 GHz 0.30 GHz
• GPU (Turbo)
  0.85 GHz 1.00 GHz
• Unités d'exécution
  24 24
• Shader
  192 192
• Max. GPU Memory
  16 GB 16 GB
• Max. displays
  3 3
• Génération
  9 9
• DirectX Version
  12 12
• Processus technologique
  14 nm 14 nm
• Date de sortie
  Q3/2015 Q3/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Non Non
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Intel Core m7-6Y75 et Intel Core m3-6Y30. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3-1866 LPDDR3-1866
• ECC
  Non Non
• Canaux de mémoire
  2 2
• Version PCIe
  3.0 3.0
• Couloirs PCIe
  10 10

• AES-NI
  Oui Oui

Analyze the TDP (Thermal Design Power) requirements of Intel Core m3-6Y30 et Intel Core m7-6Y75 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  4.5 W 4.5 W

Information on architecture, interfaces, and additional instructions supported by Intel Core m3-6Y30 et Intel Core m7-6Y75, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualization
  VT-x, VT-x EPT, VT-d VT-x, VT-x EPT, VT-d
• Extensions ISA
  SSE4.1, SSE4.2, AVX2 SSE4.1, SSE4.2, AVX2
• L3-Cache
  4.00 MB 4.00 MB
• Architecture
  Skylake Y Skylake Y
• Processus technologique
  14 nm 14 nm
• Socket
  BGA 1515 BGA 1515
• Date de sortie
  Q3/2015 Q3/2015