Intel Core i3-2367M contre Intel Core i3-2370M. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  Intel Core i3 Intel Core i3
• Génération
  2 2
• Groupe de CPU
  Intel Core i 2000M Intel Core i 2000M

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.40 GHz 2.40 GHz
• Cœurs de CPU
  2 2
• Turbo (1 cœur)
  Pas de turbo Pas de turbo
• Fils de processeur
  4 4
• Turbo (2 Cores)
  Pas de turbo Pas de turbo
• Hyperthreading
  Oui Oui
• Overclocking
  Non Non
• Architecture de base
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Intel HD Graphics 3000 Intel HD Graphics 3000
• GPU frequency
  0.35 GHz 0.65 GHz
• GPU (Turbo)
  1.00 GHz 1.15 GHz
• Unités d'exécution
  12 12
• Shader
  96 96
• Max. displays
  2 2
• Génération
  6 6
• DirectX Version
  10.1 10.1
• Processus technologique
  32 nm 32 nm
• Date de sortie
  Q1/2011 Q1/2011

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Non
• h265 / HEVC (10 bit)
  Non Non
• h264
  Decode / Encode Decode / Encode
• VP9
  Non Non
• VP8
  Non Non
• AV1
  Non Non
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Non Non

Overview of the types and quantities of RAM supported by Intel Core i3-2370M et Intel Core i3-2367M. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  DDR3-1066DDR3-1333 DDR3-1066DDR3-1333
• Max. Mémoire
  16 GB 16 GB
• ECC
  Oui Oui
• Canaux de mémoire
  2 2
• Version PCIe
  2.0 2.0
• Couloirs PCIe
  16 16

• AES-NI
  Oui Oui

Analyze the TDP (Thermal Design Power) requirements of Intel Core i3-2367M et Intel Core i3-2370M to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  17 W 35 W
• Température maximale
  100 °C 85 °C

Information on architecture, interfaces, and additional instructions supported by Intel Core i3-2367M et Intel Core i3-2370M, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualization
  VT-x, VT-x EPT VT-x, VT-x EPT
• Extensions ISA
  SSE4.1, SSE4.2, AVX SSE4.1, SSE4.2, AVX
• L3-Cache
  3.00 MB 3.00 MB
• Architecture
  Sandy Bridge H Sandy Bridge H
• Processus technologique
  32 nm 32 nm
• Socket
  BGA 1023 PPGA 988
• Date de sortie
  Q4/2011 Q1/2012