HiSilicon Kirin 9000 contre HiSilicon Kirin 9000E. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  HiSilicon Kirin HiSilicon Kirin
• Génération
  9 9
• Groupe de CPU
  HiSilicon Kirin 9000 HiSilicon Kirin 9000

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  2.05 GHz 2.04 GHz
• Cœurs de CPU
  8 8
• Turbo (1 cœur)
  3.13 GHz 3.13 GHz
• Fils de processeur
  8 8
• Turbo (8 Cores)
  2.54 GHz 2.54 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  1x Cortex-A77 1x Cortex-A77
• B core
  3x Cortex-A77 3x Cortex-A77
• C core
  4x Cortex-A55 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  ARM Mali-G78 MP24 ARM Mali-G78 MP22
• GPU frequency
  0.76 GHz 0.76 GHz
• GPU (Turbo)
  Pas de turbo Pas de turbo
• Unités d'exécution
  24 22
• Shader
  384 352
• Max. displays
  1 1
• Génération
  Vallhall 2 Vallhall 2
• DirectX Version
  12 12
• Processus technologique
  5 nm 5 nm
• Date de sortie
  Q4/2020 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Decode Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 9000E et HiSilicon Kirin 9000. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4X-2133LPDDR5-2750 LPDDR4X-2133LPDDR5-2750
• ECC
  Non Non
• Canaux de mémoire
  4 4

• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 9000 et HiSilicon Kirin 9000E to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 9000 et HiSilicon Kirin 9000E, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A77 / Cortex-A55 Cortex-A77 / Cortex-A55
• Processus technologique
  5 nm 5 nm
• Socket
  N/A N/A
• Date de sortie
  Q4/2020 Q4/2020