AMD Ryzen 9 5900 contre Intel Xeon W-1370. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Desktop / Server Desktop / Server
• Série
  AMD Ryzen Intel Xeon W
• Génération
  4 11
• Groupe de CPU
  AMD Ryzen 5000 Intel Xeon W-1300
• Modèle précédent
  AMD Ryzen 9 3900 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  3.50 GHz 2.90 GHz
• Cœurs de CPU
  12 8
• Turbo (1 cœur)
  4.70 GHz 5.10 GHz
• Fils de processeur
  24 16
• Hyperthreading
  Oui Oui
• Overclocking
  Oui Non
• Architecture de base
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  pas d'iGPU Intel UHD Graphics P750
• GPU frequency
  0.35 GHz
• GPU (Turbo)
  Pas de turbo 1.30 GHz
• Unités d'exécution
  32
• Shader
  256
• Max. displays
  3
• Génération
  12
• DirectX Version
  12
• Processus technologique
  14 nm
• Date de sortie
  Q2/2021

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Decode / Encode
• h265 / HEVC (10 bit)
  Non Decode / Encode
• h264
  Non Decode / Encode
• VP9
  Non Decode / Encode
• VP8
  Non Decode
• AV1
  Non Decode
• AVC
  Non Decode / Encode
• VC-1
  Non Decode
• JPEG
  Non Decode / Encode

Overview of the types and quantities of RAM supported by Intel Xeon W-1370 et AMD Ryzen 9 5900. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  DDR4-3200 DDR4-3200
• Max. Mémoire
  128 GB 128 GB
• ECC
  Oui Oui
• Canaux de mémoire
  2 2
• Version PCIe
  4.0 4.0
• Couloirs PCIe
  20 20

• AES-NI
  Oui Oui

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen 9 5900 et Intel Xeon W-1370 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  65 W 80 W
• Température maximale
  95 °C 100 °C

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen 9 5900 et Intel Xeon W-1370, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Virtualization
  AMD-V, SVM VT-x, VT-x EPT, VT-d
• Extensions ISA
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  6.00 MB 16.00 MB
• L3-Cache
  64.00 MB --
• Architecture
  Vermeer (Zen 3) Rocket Lake S
• Processus technologique
  7 nm 14 nm
• Socket
  AM4 LGA 1200
• Date de sortie
  Q2/2021 Q2/2021