HiSilicon Kirin 935
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Liberado
Q1/2015
HiSilicon Kirin 935

Procesador HiSilicon Kirin 935, especificaciones y puntos de referencia

El procesador HiSilicon Kirin 935 se instala en placas con socket N/A y funciona a una frecuencia de 1.50 GHz. El HiSilicon Kirin 935 tiene un total de 8 núcleos. Fecha de lanzamiento: Q1/2015. TDP es . Esta revisión proporciona todas las especificaciones técnicas y los datos detallados sobre el procesador HiSilicon Kirin 935. Descubre todo para saber si un juego o software funcionará en el HiSilicon Kirin 935.

Especificaciones

Datos técnicos
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segmento
    Mobile
  • Serie
  • Generación
    3
  • Grupo CPU
    HiSilicon Kirin 930
  • Modelo anterior
    --
  • Successor
    --
CPU Technical Specs

HiSilicon Kirin 935. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Frecuencia
    1.50 GHz
  • Núcleos de CPU
    8
  • Turbo (1 núcleo)
    2.20 GHz
  • Hilos de la CPU
    8
  • Turbo (8 Cores)
    2.20 GHz
  • Hyperthreading
    No
  • Overclocking
    No
  • Arquitectura del núcleo
    hybrid (big.LITTLE)
  • A core
    4x Cortex-A53
  • B core
    4x Cortex-A53
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • Nombre de la GPU
    ARM Mali-T628 MP4
  • GPU frequency
    0.68 GHz
  • GPU (Turbo)
    0.68 GHz
  • Unidades de ejecución
    4
  • Shader
    64
  • Max. GPU Memory
    --
  • Max. displays
    1
  • Generación
    Midgard 2
  • DirectX Version
    11
  • Proceso técnico
    32nm
  • Fecha de publicación
    Q4/2012
Compatibilidad con códecs de hardware

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    No
  • h265 / HEVC (10 bit)
    No
  • h264
    Decode / Encode
  • VP9
    No
  • VP8
    Decode / Encode
  • AV1
    No
  • AVC
    No
  • VC-1
    No
  • JPEG
    No
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Tipo de memoria
    LPDDR3-1600
  • Max. Memoria
  • ECC
    No
  • Canales de memoria
    2
  • Versión PCIe
  • Carriles PCIe
Cifrado

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    No
Consumo de energía
  • TDP (PL1)
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Temperatura máxima
    --
* ver más abajo
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Juego de instrucciones (ISA)
    ARMv8-A64 (64 bit)
  • Virtualización
    None
  • Extensiones ISA
  • L2-Cache
    --
  • L3-Cache
    --
  • Arquitectura
    Cortex-A53 / Cortex-A53
  • Proceso técnico
    28 nm
  • Enchufe
    N/A
  • Fecha de publicación
    Q1/2015
  • Part Number
    --
Posiciones en todas las clasificaciones

Posiciones comunes HiSilicon Kirin 935 CPU en pruebas de referencia populares, para comparar con otros modelos.

  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1606 place

Puntos de referencia

Pruebas de rendimiento CPU

Compare the benchmark scores of HiSilicon Kirin 935 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

iGPU - FP32 Performance (Single-precision GFLOPS)
El rendimiento de la iGPU - la GPU interna en los juegos.
94
94
90
87
HiSilicon Kirin 935

Sinónimos

Procesadores similares en términos de rendimiento.

Similar en los procesadores de datos técnicos con HiSilicon Kirin 935.

AMD A4-5000 Ver
AMD A6-3420M Ver
AMD A8-3500M Ver
AMD E2-6110 Ver
AMD E-240 Ver
AMD G-T52R Ver
Apple A8X Ver
HiSilicon Kirin 930 Ver

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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HiSilicon Kirin 935

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