UNISOC T760 contra Qualcomm Snapdragon 750G. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  UNISOC 5G Qualcomm Snapdragon
• Grupo CPU
  UNISOC 5G 6nm Qualcomm Snapdragon 750
• Segmento
  Mobile Mobile
• Generación
  0 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  4x Cortex-A76 2x Kryo 570 Gold
• B-Core
  4x Cortex-A55 6x Kryo 570 Silver
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-G57 MP4 Qualcomm Adreno 619
• GPU frequency
  0.65 GHz 0.95 GHz
• GPU (Turbo)
  sin turbo sin turbo
• Unidades de ejecución
  4 0
• Shader
  64 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generación
  Vallhall 1 6
• Direct X
  12 12.1
• Proceso técnico
  7 nm 8 nm
• Fecha de publicación
  Q2/2020 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 750G y UNISOC T760. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memoria
  8 GB
• Canales de memoria
  2 (Dual Channel) 2
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of UNISOC T760 y Qualcomm Snapdragon 750G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T760 y Qualcomm Snapdragon 750G, including virtual machine technologies and fabrication processes.

• Proceso técnico
  6 nm 8 nm
• Enchufe
  -- N/A
• Arquitectura
  Kryo 570
• Virtualización
  None None
• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Fecha de publicación
  Q2/2021 Q4/2020
• Part Number
  -- SM7225