HiSilicon Kirin 960 contra Samsung Exynos 7880. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin Samsung Exynos
• Generación
  5 1
• Grupo CPU
  HiSilicon Kirin 960 Samsung Exynos 7570/7870/7880

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.80 GHz 1.90 GHz
• Turbo (1 núcleo)
  2.40 GHz 1.90 GHz
• Turbo (8 Cores)
  2.40 GHz 1.90 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  hybrid (big.LITTLE) normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-G71 MP8 ARM Mali-T830 MP3
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  sin turbo 0.60 GHz
• Unidades de ejecución
  8 3
• Shader
  256 48
• Max. GPU Memory
  2 GB --
• Max. displays
  2 2
• Generación
  Bifrost 1 Midgard 4
• Proceso técnico
  16 nm 28nm
• Fecha de publicación
  Q2/2016 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  No No
• VP8
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  Decode / Encode No
• VC-1
  No No
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Samsung Exynos 7880 y HiSilicon Kirin 960. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR4-1600 LPDDR4-1600
• Max. Memoria
  6 GB
• ECC
  No No
• Canales de memoria
  2 0

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 960 y Samsung Exynos 7880 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 960 y Samsung Exynos 7880, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualización
  None None
• L2-Cache
  -- 2.00 MB
• L3-Cache
  4.00 MB --
• Arquitectura
  Cortex-A73 / Cortex-A53 Cortex-A53
• Proceso técnico
  16 nm 14 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q4/2016 Q1/2017