HiSilicon Kirin 920 contra HiSilicon Kirin 930. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin HiSilicon Kirin
• Generación
  2 3
• Grupo CPU
  HiSilicon Kirin 920 HiSilicon Kirin 930

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.30 GHz 1.50 GHz
• Núcleos de CPU
  8 8
• Turbo (1 núcleo)
  1.70 GHz 2.00 GHz
• Hilos de la CPU
  8 8
• Turbo (8 Cores)
  1.70 GHz 2.00 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Cortex-A15 4x Cortex-A53
• B core
  4x Cortex-A7 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-T628 MP4 ARM Mali-T628 MP4
• GPU frequency
  0.60 GHz 0.60 GHz
• GPU (Turbo)
  0.60 GHz 0.60 GHz
• Unidades de ejecución
  4 4
• Shader
  64 64
• Max. displays
  1 1
• Generación
  Midgard 2 Midgard 2
• DirectX Version
  11 11
• Proceso técnico
  32nm 32nm
• Fecha de publicación
  Q4/2012 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  Decode / Encode Decode / Encode
• VP9
  No No
• VP8
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  No No
• VC-1
  No No
• JPEG
  No No

Overview of the types and quantities of RAM supported by HiSilicon Kirin 930 y HiSilicon Kirin 920. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3-1600 LPDDR3-1600
• ECC
  No No
• Canales de memoria
  2 2

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 920 y HiSilicon Kirin 930 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 920 y HiSilicon Kirin 930, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• Virtualización
  None None
• Arquitectura
  Cortex-A15 / Cortex-A7 Cortex-A53 / Cortex-A53
• Proceso técnico
  28 nm 28 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q3/2014 Q1/2015