HiSilicon Kirin 910 contra Qualcomm Snapdragon 439. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin Qualcomm Snapdragon
• Generación
  1 4
• Grupo CPU
  HiSilicon Kirin 910 Qualcomm Snapdragon 439

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.60 GHz 1.45 GHz
• Núcleos de CPU
  4 8
• Turbo (1 núcleo)
  1.60 GHz 1.95 GHz
• Hilos de la CPU
  4 8
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  normal hybrid (big.LITTLE)
• A core
  -- 4x Cortex-A53
• B core
  -- 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-450 MP4 Qualcomm Adreno 505
• GPU frequency
  0.53 GHz 0.45 GHz
• GPU (Turbo)
  0.53 GHz 0.45 GHz
• Unidades de ejecución
  4 0
• Shader
  64 48
• Max. displays
  1 0
• Generación
  Utgard 5
• DirectX Version
  0 11
• Proceso técnico
  28nm 28 nm
• Fecha de publicación
  2012 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No Decode
• h265 / HEVC (10 bit)
  No No
• h264
  No Decode / Encode
• VP9
  No No
• VP8
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  No Decode
• JPEG
  No Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 439 y HiSilicon Kirin 910. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3 LPDDR3
• ECC
  No No
• Canales de memoria
  1 1

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 910 y Qualcomm Snapdragon 439 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 910 y Qualcomm Snapdragon 439, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv7-A32 (32 bit) ARMv8-A64 (64 bit)
• Virtualización
  None None
• Arquitectura
  Cortex-A9 Cortex-A53
• Proceso técnico
  28 nm 12 nm
• Enchufe
  N/A N/A
• Fecha de publicación
  Q1/2014 Q3/2018
• Part Number
  -- SDM439