UNISOC T760 vs HiSilicon Kirin 820 5G. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  UNISOC 5G HiSilicon Kirin
• CPU group
  UNISOC 5G 6nm HiSilicon Kirin 810/820
• Segment
  Mobile Mobile
• Generation
  0 6

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G57 MP4 ARM Mali-G57 MP6
• GPU frequency
  0.65 GHz 0.85 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  4 6
• Shader
  64 96
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  Vallhall 1 Vallhall 1
• Technology
  7 nm 7 nm
• Release date
  Q2/2020 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 820 5G and UNISOC T760. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Memory channels
  2 (Dual Channel) 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of UNISOC T760 and HiSilicon Kirin 820 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T760 and HiSilicon Kirin 820 5G, including virtual machine technologies and fabrication processes.

• Technology
  6 nm 7 nm
• Socket
  -- N/A
• L3-Cache
  -- 2.00 MB
• Architecture
  Cortex-A76 / Cortex-A55
• Virtualization
  None None
• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Release date
  Q2/2021 Q2/2019