MediaTek Helio G95 vs HiSilicon Kirin 810. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  Mediatek Helio HiSilicon Kirin
• Generation
  1 6
• CPU group
  MediaTek Helio G90 HiSilicon Kirin 810/820

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  2.00 GHz 1.90 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.05 GHz 2.20 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.00 GHz 2.20 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A76 2x Cortex-A76
• B core
  6x Cortex-A55 6x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G76 MP4 ARM Mali-G52 MP6
• GPU frequency
  0.90 GHz 0.85 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  4 16
• Shader
  64 288
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  Bifrost 3 Bifrost 2
• DirectX Version
  12 12
• Technology
  7 nm 12 nm
• Release date
  Q3/2018 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 810 and MediaTek Helio G95. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memory
  10 GB 6 GB
• ECC
  No No
• Memory channels
  2 4
• PCIe version
  --
• PCIe lanes
  --

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio G95 and HiSilicon Kirin 810 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  -- 5 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio G95 and HiSilicon Kirin 810, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• ISA extensions
  --
• L3-Cache
  -- 1.00 MB
• Architecture
  Cortex-A76 / Cortex-A55 Cortex-A76 / Cortex-A55
• Technology
  12 nm 7 nm
• Socket
  N/A N/A
• Release date
  Q3/2019 Q2/2019
• Part Number
  MT6785V/CD --