MediaTek Helio G70 vs MediaTek Helio G80. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  Mediatek Helio Mediatek Helio
• Generation
  1 1
• CPU group
  MediaTek Helio G70/G80 MediaTek Helio G70/G80

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  1.70 GHz 1.80 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.00 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.70 GHz 1.80 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A75 2x Cortex-A75
• B core
  6x Cortex-A55 6x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G52 MP2 ARM Mali-G52 MP2
• GPU frequency
  0.82 GHz 0.95 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  2 2
• Shader
  32 32
• Max. displays
  2 2
• Generation
  Bifrost 2 Bifrost 2
• DirectX Version
  12 12
• Technology
  16 nm 16 nm
• Release date
  Q3/2020 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  No No
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G80 and MediaTek Helio G70. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-1800 LPDDR4X-1800
• Max. Memory
  8 GB 8 GB
• ECC
  No No
• Memory channels
  2 2

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio G70 and MediaTek Helio G80 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio G70 and MediaTek Helio G80, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A75 / Cortex-A55 Cortex-A75 / Cortex-A55
• Technology
  12 nm 12 nm
• Socket
  N/A N/A
• Release date
  Q1/2020 Q2/2020
• Part Number
  MT6769V/CB MT6769T