HiSilicon Kirin 985 5G vs Qualcomm Snapdragon 7c. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  HiSilicon Kirin Qualcomm Snapdragon
• Generation
  7 2
• CPU group
  HiSilicon Kirin 980 Qualcomm Snapdragon 7c
• Successor
  -- Qualcomm Snapdragon 7c Gen 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  1.84 GHz 2.40 GHz
• Turbo (1 Core)
  2.40 GHz 2.40 GHz
• Turbo (8 Cores)
  2.58 GHz 2.40 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G77 MP8 Qualcomm Adreno 618
• GPU frequency
  0.80 GHz 0.70 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  8 0
• Shader
  128 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 2
• Generation
  Vallhall 1 6
• Technology
  7 nm 14 nm
• Release date
  Q2/2019 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 7c and HiSilicon Kirin 985 5G. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• ECC
  No No
• Memory channels
  4 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 985 5G and Qualcomm Snapdragon 7c to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 985 5G and Qualcomm Snapdragon 7c, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A76 / Cortex-A55 Kryo 468
• Technology
  7 nm 8 nm
• Socket
  N/A N/A
• Release date
  Q2/2020 2020
• Part Number
  Hi6290 SC7180