Samsung Exynos 1330 gegen MediaTek Dimensity 1080. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Samsung Exynos Mediatek Dimensity
• CPU Gruppe
  Samsung Exynos 13xx MediaTek Dimensity 10xx
• Segment
  Mobile Mobile
• Generation
  7 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A78 2x Cortex-A78
• B-Core
  6x Cortex-A55 6x Cortex-A55
• Hyperthreading / SMT
  Nein Nein
• Übertaktung
  Nein Nein
• A-Core Frequency
  2.40 GHz 2.60 GHz
• B-Core Frequency
  2.00 GHz 2.00 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G68 MP2 ARM Mali-G68 MP4
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  2 4
• Shader
  32 64
• Max. displays
  1 1
• Generation
  Vallhall 2 Vallhall 2
• Direct X
  12 12
• technisches verfahren
  6 nm 6 nm
• Datum der Veröffentlichung
  Q2/2020 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 1080 und Samsung Exynos 1330. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4XLPDDR5 LPDDR4XLPDDR5
• ECC
  Nein Nein
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 1330 und MediaTek Dimensity 1080 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 1330 und MediaTek Dimensity 1080, including virtual machine technologies and fabrication processes.

• technisches verfahren
  5 nm 6 nm
• Chip design
  Chiplet
• Architektur
  Cortex-A78/-A55 Cortex-A78 / Cortex-A55
• Operating systems
  Android, Windows ARM Android
• Virtualisierung
  None None
• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Datum der Veröffentlichung
  Q1/2023 Q4/2022
• Part Number
  S5E8535 MT6877V/TTZA
• Spezifikation
  Technical data sheet Technical data sheet