Qualcomm Snapdragon 7c Gen 2 gegen MediaTek Dimensity 800. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Mediatek Dimensity
• CPU Gruppe
  Qualcomm Snapdragon 7c MediaTek Dimensity 700/720/800
• Segment
  Mobile Mobile
• Generation
  2 1
• Vergangenes Modell
  Qualcomm Snapdragon 7c --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequenz
  2.55 GHz 2.00 GHz
• Turbo (1 Kern)
  2.55 GHz 2.00 GHz
• Turbo (8 Cores)
  2.55 GHz 2.00 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 618 ARM Mali-G57 MP4
• GPU frequency
  0.70 GHz 0.65 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Ausführungseinheiten
  0 4
• Shader
  128 64
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  6 Vallhall 1
• technisches verfahren
  14 nm 7 nm
• Datum der Veröffentlichung
  Q2/2019 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  Nein Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 800 und Qualcomm Snapdragon 7c Gen 2. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-2133 LPDDR4X-2133
• Max. Speicher
  16 GB
• Speicherkanäle
  2 2
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 7c Gen 2 und MediaTek Dimensity 800 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 7c Gen 2 und MediaTek Dimensity 800, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architektur
  Kryo 468 Cortex-A76 / Cortex-A55
• technisches verfahren
  8 nm 7 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q2/2021 Q2/2020
• Part Number
  SC7180P MT6873