Qualcomm Snapdragon 750G gegen Samsung Exynos 5430. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Samsung Exynos
• CPU Gruppe
  Qualcomm Snapdragon 750 Samsung Exynos 5430
• Segment
  Mobile Mobile
• Generation
  3 4

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Kryo 570 Gold 4x Cortex-A15
• B-Core
  6x Kryo 570 Silver 4x Cortex-A7
• Frequenz
  1.80 GHz 1.40 GHz
• Turbo (1 Kern)
  2.20 GHz 2.00 GHz
• Turbo (8 Cores)
  2.20 GHz 2.00 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 619 ARM Mali-T628 MP6
• GPU frequency
  0.95 GHz 0.60 GHz
• GPU (Turbo)
  kein Turbo 0.60 GHz
• Ausführungseinheiten
  0 6
• Shader
  128 96
• Max. GPU Memory
  4 GB --
• Max. displays
  2 1
• Generation
  6 Midgard 2
• Direct X
  12.1 11
• technisches verfahren
  8 nm 32nm
• Datum der Veröffentlichung
  Q2/2020 Q4/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Nein
• h265 / HEVC (10 bit)
  Decode Nein
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Nein
• AV1
  Nein Nein
• AVC
  Decode Nein
• VC-1
  Decode Nein
• JPEG
  Decode / Encode Nein

Overview of the types and quantities of RAM supported by Samsung Exynos 5430 und Qualcomm Snapdragon 750G. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-2133 LPDDR3e-1066
• Max. Speicher
  8 GB
• Speicherkanäle
  2 0
• ECC
  Nein Nein
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 750G und Samsung Exynos 5430 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 750G und Samsung Exynos 5430, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv7-A32 (32 bit)
• L2-Cache
  -- 2.50 MB
• Architektur
  Kryo 570 Cortex-A15 / Cortex-A7
• technisches verfahren
  8 nm 20 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q4/2020 Q3/2014
• Part Number
  SM7225 --