Qualcomm Snapdragon 730 gegen Qualcomm Snapdragon 845. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU Gruppe
  Qualcomm Snapdragon 730 Qualcomm Snapdragon 845
• Segment
  Mobile Mobile
• Generation
  2 5

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Frequenz
  1.80 GHz 1.80 GHz
• Turbo (1 Kern)
  2.20 GHz 2.80 GHz
• Turbo (8 Cores)
  2.20 GHz 2.80 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 618 Qualcomm Adreno 630
• GPU frequency
  0.70 GHz 0.70 GHz
• GPU (Turbo)
  kein Turbo kein Turbo
• Shader
  128 256
• Max. GPU Memory
  4 GB 8 GB
• Max. displays
  2 2
• Generation
  6 4
• technisches verfahren
  14 nm 10 nm
• Datum der Veröffentlichung
  Q2/2019 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode
• VP9
  Decode Decode
• AV1
  Nein Nein
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 845 und Qualcomm Snapdragon 730. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-1866 LPDDR4X-1866
• Max. Speicher
  8 GB 8 GB
• Speicherkanäle
  2 4
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 730 und Qualcomm Snapdragon 845 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 730 und Qualcomm Snapdragon 845, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  -- 0.51 MB
• L3-Cache
  -- 2.00 MB
• Architektur
  Kryo 470 Gold/475 Silver Kryo 385
• technisches verfahren
  8 nm 10 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q2/2019 Q1/2018
• Part Number
  SM7150-AA SDM845