Qualcomm Snapdragon 410 gegen Qualcomm Snapdragon 425. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU Gruppe
  Qualcomm Snapdragon 410 Qualcomm Snapdragon 425/427
• Segment
  Mobile Mobile
• Generation
  2 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Zentrale Architektur
  normal normal
• Frequenz
  1.20 GHz 1.40 GHz
• Turbo (1 Kern)
  1.20 GHz 1.40 GHz
• Turbo (4 Cores)
  1.20 GHz 1.40 GHz
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 306 Qualcomm Adreno 308
• GPU frequency
  0.40 GHz 0.50 GHz
• GPU (Turbo)
  0.40 GHz 0.50 GHz
• Shader
  24 24
• Generation
  3 3
• technisches verfahren
  28 nm 28 nm
• Datum der Veröffentlichung
  Q3/2012 Q1/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Nein Nein
• h264
  Decode / Encode Decode / Encode
• VP8
  Nein Nein
• VP9
  Nein Nein
• AV1
  Nein Nein
• AVC
  Nein Nein
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 425 und Qualcomm Snapdragon 410. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR2-533LPDDR3-533 LPDDR3-667
• Speicherkanäle
  1 1
• ECC
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 410 und Qualcomm Snapdragon 425 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 410 und Qualcomm Snapdragon 425, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architektur
  Cortex-A53 Cortex-A53
• technisches verfahren
  28 nm 28 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  2014 Q3/2016
• Part Number
  APQ8016 MSM8917