AMD Ryzen 9 5900HS Creator Edition
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Q3/2021
AMD Ryzen 9 5900HS Creator Edition

Prozessor AMD Ryzen 9 5900HS Creator Edition, Spezifikationen und Benchmarks

203 Platz in der Gesamtwertung CPUs!
Der AMD Ryzen 9 5900HS Creator Edition Prozessor wird in FP6 Sockel-Platinen installiert und arbeitet mit einer Frequenz von 3.30 GHz. Der AMD Ryzen 9 5900HS Creator Edition hat insgesamt 8 Kerne. Erscheinungsdatum: Q3/2021. TDP beträgt 45 W. Diese Übersicht bietet alle technischen Daten und detaillierten Informationen zum AMD Ryzen 9 5900HS Creator Edition Prozessor. Erfahren Sie alles, um festzustellen, ob Spiele oder Software auf AMD Ryzen 9 5900HS Creator Edition laufen.

Specifications

Technische Daten
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segment
    Mobile
  • Serie
  • Generation
    4
  • CPU Gruppe
    AMD Ryzen 5000H
  • Vergangenes Modell
    --
  • Successor
    --
CPU Technical Specs

AMD Ryzen 9 5900HS Creator Edition. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Frequenz
    3.30 GHz
  • CPU Kerne
    8
  • Turbo (1 Kern)
    4.60 GHz
  • CPU Threads
    16
  • Turbo (8 Cores)
    4.20 GHz
  • Hyperthreading
    Ja
  • Übertaktung
    Nein
  • Zentrale Architektur
    normal
  • A core
    --
  • B core
    --
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • GPU-Name
    AMD Radeon 8 Graphics (Renoir)
  • GPU frequency
    1.90 GHz
  • GPU (Turbo)
    kein Turbo
  • Ausführungseinheiten
    8
  • Shader
    512
  • Max. GPU Memory
    2 GB
  • Max. displays
    3
  • Generation
    9
  • DirectX Version
    12
  • technisches verfahren
    7 nm
  • Datum der Veröffentlichung
    Q1/2020
Hardware Codec Unterstützung

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP9
    Decode / Encode
  • VP8
    Decode / Encode
  • AV1
    Nein
  • AVC
    Decode / Encode
  • VC-1
    Decode
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Speicher Typ
    DDR4-3200LPDDR4-4266
  • Max. Speicher
    64 GB
  • ECC
    Nein
  • Speicherkanäle
    2
  • PCIe-Version
    3.0
  • PCIe-Lanes
    12
Verschlüsselung

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Ja
Energieverbrauch
  • TDP (PL1)
    45 W
  • TDP up
    54 W
  • TDP (PL2)
    --
  • TDP down
    35 W
  • Maximale Temperatur
    105 °C
* siehe unten
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Befehlssatz (ISA)
    x86-64 (64 bit)
  • Virtualisierung
    AMD-V, SVM
  • ISA-Erweiterungen
    SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
  • L2-Cache
    4.00 MB
  • L3-Cache
    16.00 MB
  • Architektur
    Cezanne (Zen 3)
  • technisches verfahren
    7 nm
  • Steckdose
    FP6
  • Datum der Veröffentlichung
    Q3/2021
  • Part Number
    --
Positionen in allen Ranglisten

Gemeinsame Standpunkte AMD Ryzen 9 5900HS Creator Edition CPU in gängigen Benchmarks, zum Vergleich mit anderen Modellen.

  • Cinebench R23 (Single-Core)
    141 place
  • Cinebench R23 (Multi-Core)
    106 place
  • Cinebench R20 (Single-Core)
    93 place
  • Cinebench R20 (Multi-Core)
    93 place
  • Geekbench 5, 64bit (Single-Core)
    229 place
  • Geekbench 5, 64bit (Multi-Core)
    330 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    116 place
  • Blender 2.81 (bmw27)
    149 place
  • Geekbench 6 (Single-Core)
    158 place

Benchmarks (tests)

Leistungstests CPU

Compare the benchmark scores of AMD Ryzen 9 5900HS Creator Edition with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Synonyme

Ähnliche Prozessoren in Bezug auf die Leistung.

Ähnlich bei technischen Datenverarbeitern mit AMD Ryzen 9 5900HS Creator Edition.

AMD Ryzen 9 5900HX Siehe
Intel Core i7-7820X Siehe
Intel Xeon Platinum 8176M Siehe
Intel Core i7-9700KF Siehe
Intel Core i7-10700KF Siehe
Intel Xeon W-2170B Siehe
Intel Xeon W-2175 Siehe
AMD Ryzen 9 7900X3D Siehe

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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AMD Ryzen 9 5900HS Creator Edition

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